As PCBAmanufacturing precision continues to increase, 3D X-ray inspection technologyis becoming a core means of ensuring product quality. This technologypenetrates the circuit board's surface to create three-dimensional images ofinternal solder joints and components, providing a reliable quality monitoringsolution for high-density, miniaturized electronic assemblies.
TechnicalPrinciple: 3D X-ray inspection utilizes the differences in X-ray absorption bydifferent materials to generate a three-dimensional model of the circuitboard's internal structure through multi-angle scanning. Its core advantagelies in its ability to overcome visual blind spots, clearly demonstrating thesolder joint status of bottom solder balls on BGAs and CSPs, as well as hiddendefects such as voids and cold solder joints in multilayer boards. Withinspection accuracy reaching micron levels, even tiny solder joints smallerthan 0.1mm can be accurately identified.
QualityAdvantages:
· Comprehensively inspect hidden solderjoints, eliminating omissions associated with traditional optical inspection.
· Quantitatively analyze key parameterssuch as solder joint volume and void rate, enabling digital quality control.
· Supports automated batch inspection,increasing inspection speed by over 80% compared to manual spot checks.
· Strong traceability, with inspection dataarchived for production process optimization.
Applications:This technology has become a standard feature in high-reliability applications.
· New energy vehicle powertrain controlsystems (PCBA).
· Industrial robot core control boards.
· Precision medical device circuit modules.
· Satellite communication terminalcomponents.
As PCBAintegration approaches the 7nm level, traditional inspection methods are nolonger sufficient. 3D X-ray inspection not only addresses the current qualitycontrol challenges of miniaturized soldering but also, through data-drivenanalysis, promotes the transition of PCBA manufacturing from post-processinspection to preventive inspection, providing a solid foundation for thereliability of high-end electronic devices.